Neplaunamas fliusas pasižymintis padidintu lipnumu, skirtas korpusų BGA, PGA, PLCC, QFP, CSP litavimui
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Kaina €15.00
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Reference:
HB1Y304 / NC-559-ASM
AMTECH NC-559-ASM
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Data type name
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Description
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Main composition of flux
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Rosin(CAS:65997-06-0),
Succinic acid(CAS::110-15-6),
Triethylene glycol monobutyl ether
(CAS:143-22-6),Antioxidant,Rust inhibitor.
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Liveness
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Neutral
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Viscosity
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80 mPa.s
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Colour
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Off-white translucent
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Graininess
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5—10μm
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Poisonous
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Very low
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PH value
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8
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Flash point
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120℃
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The main purpose
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Chip, solder ball, tin-lead or tin-silver-copper alloy surface soldering aid and rework process
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Remark
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Very versatile halogen-free flux and has long been known. |